AOS launches innovative double-sided cooling DFN 5×6 package
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AOS launches innovative double-sided cooling DFN 5×6 package

Posted Date: 2024-01-26

AONA66916 is available in a new top-opening DFN5x6 package that enables industry-leading thermal performance and provides a more reliable design

Recently, Alpha and Omega Semiconductor Limited (AOS) (NASDAQ: AOSL), a well-known power semiconductor and chip supplier integrating design, R&D, production and global sales (NASDAQ: AOSL) AOSL) released a 100V MOSFET——AONA66916, the device is packaged in AOS’ innovative double-sided heat dissipation DFN 5 x 6 package. Customer system developers have always regarded AOS products as one of the important components of their solution design to help customers achieve various high-performance application requirements. Nowadays, AOS products have further innovated to provide the most advanced packaging to maintain the best thermal performance of its devices, allowing engineers to develop more efficient solution designs in telecommunications systems and industrial applications that operate under harsh conditions for a long time.

Generally speaking, the standard DFN 5x6 package mainly relies on the bottom pad for heat dissipation, and most of the heat generated by the device will be transferred to the PCB. In order to meet the system requirements, the difficulty of PCB thermal management design increases. The AOS double-sided thermal DFN 5x6 package allows for the highest heat transfer between the exposed top window and the heat sink due to its large surface contact area structure. This enables the device to achieve a low thermal resistance (Rthc-top max) of 0.5°C/W, significantly improving thermal performance. The top-opening DFN 5x6 package of AONA66916 has the same package and size (5mm x 6mm) as the AOS standard DFN 5x6, eliminating the need to modify the existing PCB layout and increasing power density with minimal evaluation effort.

It is worth mentioning that AONA66916 utilizes AOS 100V AlphaSGT technology, and its superior figure of merit (FOM) is perfectly suitable for hard switching applications. AONA66916 has a maximum RDS(on) value of 3.4mOhms and supports a maximum junction temperature of 175°C.

"In high-power power supply design, the heat dissipation performance of MOSFET is somewhat challenging, and AOS has successfully solved this basic problem through its advanced top-opening window package design. Due to the relatively large area of ​​the top-opening window, this not only achieves Better heat transfer between the MOSFET from the top window to the heat sink. And the lower temperature of the MOSFET also helps achieve a more efficient and robust design," said Peter H. Wilson, senior marketing director of the AOS MOSFET product line.


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