Automated 3D solder paste inspection down to 9.8μm
Automated 3D solder paste inspection down to 9.8μm
Posted Date: 2023-08-16
Referred to as TR7007Q SII it has a 9.8μm 21Mpixel digital camera and RGB+W lighting, and could be geared up with coaxial lighting.
It helps communication protocols together with IPC Linked Manufacturing unit Alternate (CFX), IPC-DPMX and IPC Hermes 9852.
Detected defects embrace inadequate paste, extreme paste, form deformity, lacking paste and bridged pads. Accessible measurements are top, space, quantity and offset.
Most PCB dimensions are 510 x 460mm (0.6 – 5mm thick) as much as 3kg and the unit is 1 x 1.5 x 1.65m with out its sign tower, weighing 795kg.
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