Chixin Microelectronics is open for business!Focus on silicon carbide plastic packaging power module packaging and testing research and development
On January 19, Chixin Microelectronics Technology (Suzhou) Co., Ltd. (hereinafter referred to as "Chixin Microelectronics") opened in District V of Hengtai Intelligent Manufacturing·Suzhou Nano City.
Chixin Microelectronics Technology (Suzhou) Co., Ltd. (hereinafter referred to as "Chixin Microelectronics") was established on May 18, 2023. It is a company focusing on the R&D, production and manufacturing of silicon carbide plastic power module packaging and testing. It is committed to research and development and Produces silicon carbide plastic power module packaging and testing technology with fully independent intellectual property rights. Compared with traditional glue-filled modules, plastic-encapsulated power modules have obvious advantages in electrothermal characteristics such as reliability, stray inductance, operating temperature, and compatibility. Plastic-encapsulated power modules will be the next generation mainstream.
The founder, Zhu Zhengyu, is a top expert in power packaging in China and is proficient in large-scale power discrete device packaging and multi-chip modules. It was the first in China to master IGBT and SiC double-sided heat dissipation plastic packaging power module packaging and testing technology. It is at the leading technological level in the country and has been recognized by peers in the industry. Author of "Power Semiconductor Device Packaging Technology" mechanical engineering edition. Proficient in 6sigma and lean production techniques.
ChiXin Microelectronics has a technical management team with more than 20 years of experience in the packaging and testing industry, covering all key aspects of module packaging such as technology, materials, and manufacturing. It has established a unique high-quality packaging and testing method and system, and has adopted domestic equipment The manufacturer has worked hard for a long time to build a nationally produced power module packaging and testing production line and laboratory, with 0-1 product development and mass production capabilities, providing advanced and reliable manufacturing services for the application promotion and development of my country's third-generation semiconductors.
It is reported that Chixin Microelectronics has recently completed tens of millions of yuan in Pre-A round financing, led by Nachuan Capital, followed by Yida Capital, Zhongguancun Collaborative Innovation Direct Investment Fund and Suzhou Endufa Automotive Systems Co., Ltd. Financing funds are mainly used for the first phase of production capacity construction, including the construction of 10,000-level clean workshops, the purchase of production equipment and laboratory equipment.
In the future, Chixin Microelectronics will draw on cutting-edge information and technology from East China to provide automotive-grade power modules that meet the needs of small size, lightweight, ultra-high power density, and fast heat dissipation, and serve customers across the country.
Review Editor: Liu Qing
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