DesignCon2024 | Xinhe Semiconductor releases “SI/PI/Multiphysics Analysis” EDA solution for next-generation electronic systems

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DesignCon2024 | Xinhe Semiconductor releases “SI/PI/Multiphysics Analysis” EDA solution for next-generation electronic systems

Posted Date: 2024-02-03

Xinhe Semiconductor officially released the SI/PI/multiphysics analysis EDA solution for next-generation electronic systems at the just-concluded DesignCon2024 conference, including signal integrity, power integrity, electromagnetic field analysis for Chiplet advanced packaging and board-level systems. Multiple EDA analysis platforms such as simulation, thermal and stress.

As a representative of domestic EDA, this is the 11th consecutive year that Xinhe Semiconductor has participated in the DesignCon conference. This DesignCon conference was held at the Santa Clara Convention Center in California, USA, for three days from January 30 to February 1.

SI/PI/multiphysics analysis EDA solutions for next-generation electronic systems

Post highlights

2.5D/3DIC Chiplet advanced packaging electromagnetic simulation platform Metis

It has rich pre-wiring simulation analysis functions and integrates the Interposer template of the industry's 2.5D/3D mainstream process technology. Users can customize the wiring form and set parameters to efficiently and accurately complete Interposer wiring analysis and evaluation; supports advanced packaging design signal\power network models S-parameter and frequency-varying RLCG parameter extraction; advanced algorithm solver and intelligent meshing technology enable high-speed and high-frequency application simulation of ultra-large-scale heterogeneous integrated packaging. Compared with the current main methods, Metis has significant advantages in computing speed and memory of various packaging structures.

Three-dimensional full-wave electromagnetic simulation platform Hermes

For segmented application scenarios such as packaging/PCB board-level systems, three major electromagnetic simulation analysis tools, Hermes Layered, Hermes 3D and Hermes X3D, are provided to meet the requirements of packaging and board-level signal model extraction, arbitrary three-dimensional structures (connectors, board-level antennas, etc.) ) electromagnetic simulation, interconnection structure RLCG parameter extraction and SPICE model generation requirements. Hermes supports simulation solutions covering DC-THz bandwidth, and greatly improves the analysis and optimization efficiency of user design models through adaptive meshing and distributed parallel computing.

Multi-physics analysis platform Notus platform

Based on Xinhe Semiconductor's powerful electromagnetic field and multi-physics simulation engine technology, Notus provides users with a more efficient and automatic way to meet design needs in signal integrity, power integrity, thermal and stress analysis. Notus provides a comprehensive simulation process, including power supply DC analysis, power supply frequency domain impedance analysis, decoupling capacitor optimization, signal topology extraction, signal interconnection model extraction, thermal and stress reliability analysis and many other key applications.

Next-generation digital system signal integrity simulation analysis platform ChannelExpert

Graphical circuit simulation interaction provides users with a fast, accurate and simple method to analyze high-speed channels. ChannelExpert has a complete set of high-speed channel comprehensive analysis functions, including frequency domain S parameters, time domain eye diagrams, statistical eye diagrams, COM, and parametric scanning and optimization. In this new version, ChannelExpert not only seamlessly connects Hermes and Notus electromagnetic field modeling tools to support field-circuit joint simulation features, but also further integrates advanced XSPICE simulation engines and templated AMI modeling tools to support Buffer models. (IBIS/AMI), S-parameters, transmission line models and Spice models for accurate simulation to meet users’ pre-simulation and post-simulation analysis needs of various DDR/SerDes types.

List of on-site release materials

Hit the spot

As the world's leading supplier of 3DIC Chiplet EDA, the Xinhe Semiconductor booth received a lot of attention.

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