ECAD/MCAD convergence for electronic systems with new AI thermal platform

Infineon / Mitsubishi / Fuji / Semikron / Eupec / IXYS

ECAD/MCAD convergence for electronic systems with new AI thermal platform

Posted Date: 2024-02-08

Cadence Design Systems, Inc. now offers Cadence Celsius Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. The solution addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, as well as electronics cooling for PCBs and complete electronic assemblies. While current product offerings comprise mostly disparate point tools, the solution introduces a new approach with a unified platform that allows electrical and mechanical/thermal engineers to concurrently design, analyse and optimise product performance without requiring geometry simplification, manipulation and/or translation.

The solution brings a new system-level thermal integrity solution into the marketplace, converging electro-thermal co-simulation, electronics cooling and thermal stress into one cohesive offering. Made feasible by the company’s acquisition of Future Facilities in 2022, the best-in-class electronics cooling technology is now available to electrical and mechanical engineers. Also, the ability to employ the solution seamlessly for in-design multiphysics analysis empowers designers to identify thermal integrity issues early in the design process and efficiently use generative AI optimisation and novel modelling algorithms to determine ideal thermal designs.

The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, reducing turnaround times and accelerating time to market.

Celsius Studio delivers the following benefits:

ECAD/MCAD Unification – Delivers seamless integration of design files with no simplification and streamlined workflows for fast and efficient in-design analysis.

AI Design Optimisation – Cadence Optimality Intelligent System Explorer’s AI technology within Celsius Studio enables fast and efficient exploration of the full design space to converge on the optimal design

In-Design Analysis of 2.5D and 3D-IC Packages – Delivers unprecedented capacity to analyse any 2.5D and 3D-IC packages without any simplification or accuracy loss.

Micro-to-Macro Modelling: The first solution capable of modelling structures as small as the IC and its power distribution and as large as the chassis where the PCB(s) are placed.

Large-Scale Simulation – Accurately simulates large systems with detailed granularity for any object of interest, including chip, package, PCB, fan or enclosure.

Multistage Analyses – Enables designers to perform multistage analyses for the design assembly process and addresses 3D-IC warpage issues for multi-die stacks on a single package.

True System-Level Thermal Analyses – Combines finite element method (FEM) with computational fluid dynamics (CFD) for full-system thermal analysis from chip to package to board and end-system.

Seamless Integration – Integrated with Cadence’s implementation platforms, including Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent System Explorer and AWR Design Environment

“Celsius Studio marks a milestone in Cadence’s expanding presence in the system analysis market by offering the first AI platform for not only chip, package and PCB thermal analysis but also electronics cooling and thermal stress that are critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs,” said Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence. “Seamless integration with Cadence’s powerful implementation platforms empowers our customers to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems.”

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