Huawei planning on using SMIC to fab 7nm ICs this year
Huawei planning on using SMIC to fab 7nm ICs this year
Huawei plans to fab 5G chips on a 7nm course of at SMIC this 12 months, reviews the Nikkei.
The chips aren't anticipated to be in telephones available on the market till subsequent 12 months.
Final 12 months, SMIC used a 7nm course of to fab a 
cryptocurrency mining chip for Bitmain Applied sciences.
The 7nm course of Huawei is utilizing is regarded as SMIC’s N+1 course of characterised by TechInsights as having Fin Pitch (FP), Contacted Poly Pitch (CPP) and Metallic 2 Pitch (M2P) sizes both bigger or the identical as TSMC’s N10 course of.
Nonetheless In depth Design Know-how Co-Optimization (DTCO) options and high-density logic libraries allow a logic transistor density of 89 million transistors per sq. millimeter (89MT/mm^2), which is corresponding to TSMC’s N7 and Intel’s 10nm, which makes SMIC’s N+1 course of a viable 7nm-class different for logicng SMziC to fab 7nm ICs this 12 months
View extra : IGBT modules | LCD displays | Electronic Components
latest Update
- T-Mobile will start automatically moving some customers to pricier plans
- Nvidia’s Jensen Huang tops “most popular CEOs” survey, check out the best and worst approval ratings
- Google recently mitigated the largest DDoS attack ever, peaking at 398 million requests per second
- Illuminating errors creates a new paradigm for quantum computing
- Alternative method cuts time for computer simulation of absorption spectrum from days to hour
- MYTH #2: e-mode devices have no Qrr
- AI energy demands could soon match the entire electricity consumption of Ireland
- Self-healing phone screens could be here by 2028
- Increased power density for POL converters with smallest buck regulator modules
- New 800V N-channel depletion mode MOSFET supplied in modified SOT-223-2L package