Micron sampling 232-layer UFS 4.0 NAND
Micron sampling 232-layer UFS 4.0 NAND
Posted Date: 2023-06-22
The reminiscence is available in capacities as much as 1TB and is being shipped to chose smartphone producers and chipset distributors.
It's Micron’s first cellular reminiscence constructed on the 232-layer TLC course of.
It's also the primary UFS 4.0 reminiscence to make use of six-plane NAND structure, which permits larger random learn throughput
It has as much as 4300 MBps sequential learn and 4000 MBps sequential write pace.
Micron is sampling 256GB, 512GB and 1TB units.
The corporate will start high-volume manufacturing of the chip in H2.
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