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NXP top-side-cooled RF amplifiers for smaller lighter 5G basestations

NXP top-side-cooled RF amplifiers for smaller lighter 5G basestations

Posted Date: 2023-06-07
NXP top-side-cooled RF amplifiers for smaller lighter 5G basestations

It's aiming at lively MIMO (a number of enter a number of output) antenna arrays, the place utilizing a top-side cooled amplifier (‘PA’ upside-down in diagram proper) permits all warmth to be extracted from one aspect of a easy PCB, leaving its different aspect accessible for the antennas.

The purpose is to chop the load of every enclosure required for the bottom station to beneath 23kg (20kg is the 2023 goal, mentioned NXP) to permit one particular person to elevate and set up them. Lighter weight and decrease wind-induced loading additionally permits lighter supporting constructions for use.

NXP top-side-cooled RF amplifiers for smaller lighter 5G basestationsStandard development utilizing its bottom-cooled amplifiers requires extra peak, mentioned NXP

The primary merchandise, accessible right now, are A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC  – the latter shall be supported by a improvement board collection.

These mixed LDMOS and GaN applied sciences, and are geared toward 200W 32-transmit 32-receive (32T32R) radios overlaying 3.3 to three.8GHz, delivering 31dB acquire and 46% effectivity over 400MHz of instantaneous bandwidth, claimed NXP.

NXP top-side-cooled RF amplifiers for smaller lighter 5G basestations

Spanning the tops of a number of scorching top-side cooled packages brings with it the problem of compensating for package deal peak variation – on this case throughout 32 to 64 energy amplifiers and another ICs on the RF PCB that want cooling.

How does the corporate suggest that designers take care of this?

“NXP recommends a niche filler sort thermal conductive materials,” NXP RF energy product supervisor Gavin Smith informed Electronics Weekly. “Typical hole distance must be stored to a minimal, and to not exceed 0.5mm based mostly on the thermal resistance vs thickness trade-off.”

This enables 0.1mm for package deal tolerance and 0.4mm for software tolerance.

And what sort of thermally-conductive materials?

“A excessive efficiency, low thermal resistance materials within the vary of 6 to 25W/mK, relying on the appliance, is advisable”, replied Smith.

Is there a steered half quantity for the thermally conductive compliant materials?

“NXP is engaged on figuring out just a few particular merchandise available on the market,” he mentioned. “Nevertheless, narrowing right down to just some will possible show troublesome as the tip purposes will range. We plan to have an app observe to offer clients additional steerage.”

On the tine of writing, no info on NXP’s three top-cooled RF amplifiers was accessible, however this hyperlink must be dwell by the point you, pricey reader, have entry to this text.

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