Panel-to-board/busbar interconnects for blind mating applications

Mouser now ships the PowerWize BMI high-current panel-to-board/busbar interconnects from Molex. Dense digital packaging typically calls for designs the place subassemblies are mated with no visible steering. These interconnects present engineers with high-current carrying capability and correct mating in hard-to-reach and visually obscured purposes like information centre energy transmission methods, base stations, battery administration inverters and electrical car charging stations.

The connectors embrace the corporate’s COEUR socket expertise, the place panel-mounted receptacle housing’s guideposts align with the internal surfaces of the header sidewalls earlier than contacts and pins interact to permit trouble-free blind mating. These conical sockets additionally provide low contact resistance and low voltage drop, creating minimal warmth era on the contact interface, leading to larger current-carrying capability than different contact designs. These headers and receptacles are additionally designed to fulfill industry-standard, safe-to-touch wants.

The interconnects present screw-mount pins connected to PCBs or busbars with solder tail pins to reinforce manufacturing flexibility in three totally different sizes: 3.4mm (75A), 6mm (110A) and 8mm (175A). Cable assemblies function ±2.00 mm of radial self-alignment to mitigate stack-up tolerance points. On the similar time, the reflow-capable/wave solder-capable solder tail headers are perfect for both pin-in-paste reflow PCB processing or wave solder PCB processing. These crimp machined contacts present a variety and settle for 1/0, 2, 4, 6, 8, or 10 AWG wires.

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