The global chiplet market size has reached US$3.1 billion
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The global chiplet market size has reached US$3.1 billion

Posted Date: 2024-01-26

Global research institution Market.us recently released a report, revealing that the size of the small chip architecture market has reached US$3.1 billion in 2023, and is expected to grow rapidly to US$107 billion in 2033, with an annual compound growth rate of 3352%. The growth rate is as high as 42.5%.

Chiplet architecture technology is an innovative heterogeneous integration technology that integrates multiple small chips with various functions into a single chip package through advanced packaging technology. This technology is seen as an effective means to overcome the failure of Moore's Law. As the demand for high-performance computing continues to grow in various industries, especially in the fields of artificial intelligence, data centers, automobiles, and consumer electronics, the advantages of small chip architecture are fully reflected, with the ability to efficiently handle complex calculations and reduce energy consumption. .

Many well-known processor manufacturers, such as Intel and AMD, are actively exploring and developing small chip architecture products. Intel's Meteor Lake processor is a typical example. It uses Foveros 3D packaging technology to successfully integrate multiple small chips based on different process technologies, achieving flexible design and optimization of specific functions.

AMD has also adopted the chiplet architecture in its Ryzen9 5900X processor and has proven its performance. The application of this technology is expected to further promote the reconstruction of the semiconductor industry ecological chain.

The report also pointed out that with the rapid development of fields such as artificial intelligence, 5G and the Internet of Things (IoT), the small chip market will usher in huge opportunities. In order to meet the standardization and interoperability needs among different chiplets, the semiconductor industry is strengthening cooperation and innovation. For example, many well-known manufacturers such as Intel, AMD, Microsoft, Meta, Google, Qualcomm, Samsung, and TSMC have established the UCIe Alliance to provide standards for the interconnection of small chip architectures.

In the global IC design field, the top five manufacturers have invested in the development and design of small chip architectures. Intel will demonstrate the world's first connected chiplet architecture processor based on the UCIe standard in 2023. This innovative achievement combines the advanced technologies of Intel and TSMC and fully demonstrates the huge potential of small chip architecture technology.

Review Editor: Huang Fei


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