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Thermal interface materials flows quick for manufacturing

Thermal interface materials flows quick for manufacturing

Posted Date: 2023-06-08
Thermal interface material flows fast for production

Referred to as GEL 60HF (HF = excessive move), long-term thermal stability is claimed by the corporate, as are properties suited to re-work and subject restore.

“The paste-like consistency allows tightly managed meting out and correct materials placement throughout meeting,” it mentioned. “Notably, the product requires low compressive power to deflect below meeting stress, minimising stress on elements, soldered joints and PCB leads.”

It's a pre-cured single-component gel that may be saved and transported at room temperature and with a one yr shelf-life from manufacture. A mess of packages suited to automated meting out can be found, from 10cc (pictured) to 7.5 litre.

“Cell phone producers with brief takt instances can obtain as much as 100g/min alongside good wetting-out properties that adhere nicely to the substrate in help of quick dwell instances,” added Chomerics advertising supervisor Ben Nudelman. “Throughput of a number of hundred items per hour is feasible.”

Whereas Nudelman mentioned 100g/minute, the determine in keeping with the info sheet and product web page is 80g/minute.

Thermal conductivity is 6.2W/mK and operation is over -55 to 200°C, with 150ppm/Okay growth. Typical minimal bond-line thickness is 0.15mm.

Electrically: resistivity is 1013Ωcm, dielectric energy 5kVac/mm and it has a dielectric fixed of ~4.8 and ~0.002 dissipation issue – the final two at 1MHz 0.5mm.

Functions are foreseen in client electronics, telecommunications tools, vitality storage units, energy provides, automotive management models, automotive sensors, CPUs and GPUs.

The product web page may be discovered right here , the info sheet right here, and there's a reliability report

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