Infineon / Mitsubishi / Fuji / Semikron / Eupec / IXYS

Thermal interface materials flows quick for manufacturing

Thermal interface materials flows quick for manufacturing

Posted Date: 2023-06-07

Thermal interface material flows fast for production

Known as GEL 60HF (HF = excessive stream), long-term thermal stability is claimed by the corporate, as are properties suited to re-work and subject restore.

“The paste-like consistency permits tightly managed dishing out and correct materials placement throughout meeting,” it mentioned. “Notably, the product requires low compressive drive to deflect below meeting stress, minimising stress on parts, soldered joints and PCB leads.”

It's a pre-cured single-component gel that may be saved and transported at room temperature and with a one 12 months shelf-life from manufacture. A large number of packages suited to automated dishing out can be found, from 10cc (pictured) to 7.5 litre.

“Cell phone producers with quick takt occasions can obtain as much as 100g/min alongside good wetting-out properties that adhere nicely to the substrate in assist of quick dwell occasions,” added Chomerics advertising and marketing supervisor Ben Nudelman. “Throughput of a number of hundred items per hour is feasible.”

Whereas Nudelman mentioned 100g/minute, the determine in keeping with the information sheet and product web page is 80g/minute.

Thermal conductivity is 6.2W/mK and operation is over -55 to 200°C, with 150ppm/Okay enlargement. Typical minimal bond-line thickness is 0.15mm.

Electrically: resistivity is 1013Ωcm, dielectric power 5kVac/mm and it has a dielectric fixed of ~4.8 and ~0.002 dissipation issue – the final two at 1MHz 0.5mm.

Functions are foreseen in shopper electronics, telecommunications tools, vitality storage units, energy provides, automotive management models, automotive sensors, CPUs and GPUs.

The product web page could be discovered right here , the information sheet right here, and there's a reliability report